Infinity Bond ProPACK M4000 Hot Melt for Difficult Substrates


Sale price$90.00

About Infinity Bond ProPACK

ProPACK is a unique new hot melt formulation specifically for bonding difficult substrates. It delivers the performance of expensive metallocene hot melts at a price point lower than most traditional EVA packaging hot melts. 


  • Bonding Difficult substrates
  • Product Assembly
  • End-of-line packaging


  • Difficult substrates
  • Plastics
  • Cardboard
  • Corrugated fiberboard
  • Containerboard
  • Paperboard
  • Boxboard
  • Chipboard
  • Coated and uncoated stock

Features & Benefits

  • Exceptional heat & cold resistance
  • Bonds coated packaging substrates
  • Clean-melting adhesive that reduces char
  • Very low cost, saves you money


Application Temperature 350-375°F (175-190°F)
Viscosity (375°F) 820 cps
Softening Point 279°F (137°C)
Open Time Short
Form Pellets
Color White

Submit the form below to get the Technical Data Sheet (TDS) or Safety Data Sheet (SDS) for this product sent to your email address.

Product Samples

Need samples of this product for testing? We offer free samples for qualifying applications.

We also have an in-house lab where we can perform adhesive testing on your behalf. If you would like to send samples of your substrates for lab testing, contact us to make arrangements.

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