About Infinity Bond ProPACK
ProPACK is a unique new hot melt formulation specifically for bonding difficult substrates. It delivers the performance of expensive metallocene hot melts at a price point lower than most traditional EVA packaging hot melts.
Applications
- Bonding Difficult substrates
- Product Assembly
- End-of-line packaging
Substrates
- Difficult substrates
- Plastics
- Cardboard
- Corrugated fiberboard
- Containerboard
- Paperboard
- Boxboard
- Chipboard
- Coated and uncoated stock
Features & Benefits
- Exceptional heat & cold resistance
- Bonds coated packaging substrates
- Clean-melting adhesive that reduces char
- Very low cost, saves you money
Specifications
| Application Temperature | 350-375°F (175-190°F) |
| Viscosity (375°F) | 820 cps |
| Softening Point | 279°F (137°C) |
| Open Time | Short |
| Form | Pellets |
| Color | White |
Submit the form below to get the Technical Data Sheet (TDS) or Safety Data Sheet (SDS) for this product sent to your email address.
Product Samples
Need samples of this product for testing? We offer free samples for qualifying applications.
We also have an in-house lab where we can perform adhesive testing on your behalf. If you would like to send samples of your substrates for lab testing, contact us to make arrangements.
