Overview of Infinity Bond EP 3530ND Epoxy
EP 3530ND is a low-viscosity, unfilled, heat-cure epoxy adhesive with high temperature resistance. It has excellent thermal and chemical resistance and maintains a lap search strength up to 210°C.
EP 3530ND epoxy can be used for coating, bonding, sealing applications where a thin film with high insulating resistance is required, particularly in elevated temperatures. It has a long pot life and bonds well to metals, glass, and ceramic substrates, with an amber color change upon cure.
Two-part kits: Pint, Quart, Gallon.
Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.
Semiconductor – Wafer to wafer bonding, MEMs devices, flip chip underfill
Hybrid – Fiber optic, hermetic seals and high temperature packaging sensors
Fiber optic – Sealing fiber into ferrules, transmitting light in the optical pathway, Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
Medical – Potting fiber optic bundles into ferrules for light guides and endoscopes; Capable of resisting several sterilization techniques; Meets USP Class VI for Biocompatibility Standards; adhesive for catheter devices
Electronics Assembly – Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics; Impregnating
Alternative to EPO-TEK® 353ND
Infinity Bond EP 3530ND is a direct replacement for EPO-TEK® 353ND epoxy adhesive. If you have questions about switching from EPO-TEK® 353ND to Infinity Bond EP 3530ND, don't hesitate to contact us.
Note: If you use the thixotropic version, EPO-TEK® 353ND-T, our replacement is EP 3530NDT.
|Mix Ratio by Weight||100/10|
|Mixed Viscosity @RT||3000-5000 cps|
|Pot Life @ 25°C (100 gram)||5-6 hours|
|Recommended Cure||1-2 minutes @ 150°C|
|Alternate Cure||5-10minutes @ 125°C|
|Lap Shear Strength @25°C (psi)||2600|
|CTE (Below Tg) 10-6/°C||54|
|Service Temp. Range||-55°C to 250°C|
|Volume Resistivity (500 V)||>1x10^15|
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