Overview of Infinity Bond EP H20E-SP Epoxy
Infinity Bond EP H20E-SP is a two-component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applications due to its high thermal conductivity. It is used for opto-electronic packaging material - LED, LCDs, and fiber optic components.
Infinity Bond EP H20E-SP is suggested for plastic IC packaging, high power devices, and high current flow, High power LEDs. It is also recommended for use in high-speed epoxy chip bonding. It is easy to apply by dispensing, screen printing, die-stamping, or by hand.
Two-part kits: Packaged in 4 oz, 8 oz, and 1 lb. containers.
Premixed syringes: Packaged in 3cc, 5cc, and 10cc disposable syringes. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H20E
Infinity Bond EP H20E-SP is a direct replacement for EPO-TEK® H20E epoxy adhesive. If you have questions about switching from EPO-TEK® H20E to Infinity Bond EP H20E-SP, don't hesitate to contact us.
|Hardness, Shore D||75|
|Lap Shear Strength to Aluminum, psi||1600|
|Volume Resistivity, ohm-cm||<0.0004|
|Glass Transition Temperature (Tg), C||100|
|Thermal Conductivity, W/mK||2.5|
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