Product Highlights
- Type: Epoxy
- Brand: Infinity Bond
Overview of Infinity Bond EP H20S Epoxy
Infinity Bond EP H20S is a silver-filled epoxy system designed specifically for chip bonding using die stamping & dispensing techniques in microelectronic and optoelectronic applications. it is used for thermal management applications due to its high thermal conductivity. It is used for opto-electronic packaging material - LED, LCDs, and fiber optic components.
EP H20S is suggested for plastic IC packaging, high power devices, and high current flow, high power LEDs. It is also recommended for use in high-speed epoxy chip bonding. It is easy to apply by dispensing, screen printing, die-stamping or by hand.
Sizes Available
Two-part kits: Packaged in 4 oz, 8 oz, and 1 lb. containers.
Premixed syringes: Packaged in 3cc, 5cc, and 10cc disposable syringes. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H20S
Infinity Bond EP H20S is a direct replacement for EPO-TEK® H20S epoxy adhesive. If you have questions about switching from EPO-TEK® H20S to Infinity Bond EP H20S, don't hesitate to contact us.
Specifications
| Color | Silver |
| Specific Gravity | 2.6-2.7 |
| Hardness, Shore D | 75 |
| Lap Shear Strength to Aluminum, psi | 1600 |
| Volume Resistivity, ohm-cm | <0.0006 |
| Glass Transition Temperature (Tg), C | 100 |
| Thermal Conductivity, W/mK | >2.5 |
Data Sheets
Use the form below to request data sheets.
Submit the form below to get the Technical Data Sheet (TDS) or Safety Data Sheet (SDS) for Infinity Bond EP H20S sent to your email address.
