Overview of Infinity Bond EP H20S Epoxy
Infinity Bond EP H20S is a silver-filled epoxy system designed specifically for chip bonding using die stamping & dispensing techniques in microelectronic and optoelectronic applications. it is used for thermal management applications due to its high thermal conductivity. It is used for opto-electronic packaging material - LED, LCDs, and fiber optic components.
EP H20S is suggested for plastic IC packaging, high power devices, and high current flow, high power LEDs. It is also recommended for use in high-speed epoxy chip bonding. It is easy to apply by dispensing, screen printing, die-stamping or by hand.
Two-part kits: Packaged in 4 oz, 8 oz, and 1 lb. containers.
Premixed syringes: Packaged in 3cc, 5cc, and 10cc disposable syringes. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H20S
Infinity Bond EP H20S is a direct replacement for EPO-TEK® H20S epoxy adhesive. If you have questions about switching from EPO-TEK® H20S to Infinity Bond EP H20S, don't hesitate to contact us.
|Hardness, Shore D||75|
|Lap Shear Strength to Aluminum, psi||1600|
|Volume Resistivity, ohm-cm||<0.0006|
|Glass Transition Temperature (Tg), C||100|
|Thermal Conductivity, W/mK||>2.5|
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