Infinity Bond EP H20S Epoxy - Alternative for EPO-TEK® H20S


⚠️ EPO-TEK® Epoxy Supply Disruption

Customers are reporting supply issues with many EPO-TEK® epoxies. If you need an alternative for any of these products, please contact us.

Overview of Infinity Bond EP H20S Epoxy

Infinity Bond EP H20S is a silver-filled epoxy system designed specifically for chip bonding using die stamping & dispensing techniques in microelectronic and optoelectronic applications. it is used for thermal management applications due to its high thermal conductivity. It is used for opto-electronic packaging material - LED, LCDs, and fiber optic components.

EP H20S is suggested for plastic IC packaging, high power devices, and high current flow, high power LEDs. It is also recommended for use in high-speed epoxy chip bonding. It is easy to apply by dispensing, screen printing, die-stamping or by hand.  

Sizes Available

Two-part kits: Packaged in 4 oz, 8 oz, and 1 lb. containers.
Premixed syringes: Packaged in 3cc, 5cc, and 10cc disposable syringes. Syringes are shipped on dry ice at -80°C.

Alternative to EPO-TEK® H20S

Infinity Bond EP H20S is a direct replacement for EPO-TEK® H20S epoxy adhesive. If you have questions about switching from EPO-TEK® H20S to Infinity Bond EP H20S, don't hesitate to contact us


Color   Silver
Specific Gravity 2.6-2.7
Hardness, Shore D 75
Lap Shear Strength to Aluminum, psi 1600
Volume Resistivity, ohm-cm <0.0006
Glass Transition Temperature (Tg), C 100
Thermal Conductivity, W/mK >2.5

Data Sheets

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Submit the form below to get the Technical Data Sheet (TDS) or Safety Data Sheet (SDS) for Infinity Bond EP H20S sent to your email address.

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