Infinity Bond EP H70E Epoxy - Alternative for EPO-TEK® H70E


Product Highlights

  • Type: Epoxy
  • Brand: Infinity Bond

Overview of Infinity Bond EP H70E Epoxy 

 Infinity Bond EP H70E is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. 

Features & Applications

  • Heat-sinking adhesive recommended for thermal management applications where good heat dissipation is necessary. 
  • Outstanding handling characteristics and long pot life at room temperature. No solvents added. 
  • This product can be screen printed, machine dispensed, stamped, or hand applied. 
  • Die-attach adhesive designed to be used in the 300C range to resist TC wire bonding operations. 
  • Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB. 
  • Can be cured very rapidly, excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.  

Sizes Available

Two-part kits: Pint, Quart, Gallon.

Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.

    Alternative to EPO-TEK® H70E

    Infinity Bond EP H70E is a direct replacement for EPO-TEK® H70E epoxy adhesive. If you have questions about switching from EPO-TEK® H70E to Infinity Bond EP H70E, don't hesitate to contact us


    Specific Gravity
    Hardness, Shore D 86
    Lap shear strength to aluminum, psi 2000
    Water Absorption (24 hr at RT), % 0.007
    Thermal Conductivity, W/mK

    Data Sheets

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