Overview of Infinity Bond EP H70E Epoxy
Infinity Bond EP H70E is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
Features & Applications
- Heat-sinking adhesive recommended for thermal management applications where good heat dissipation is necessary.
- Outstanding handling characteristics and long pot life at room temperature. No solvents added.
- This product can be screen printed, machine dispensed, stamped, or hand applied.
- Die-attach adhesive designed to be used in the 300C range to resist TC wire bonding operations.
- Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
- Can be cured very rapidly, excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Two-part kits: Pint, Quart, Gallon.
Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H70E
Infinity Bond EP H70E is a direct replacement for EPO-TEK® H70E epoxy adhesive. If you have questions about switching from EPO-TEK® H70E to Infinity Bond EP H70E, don't hesitate to contact us.
|Hardness, Shore D||86|
|Lap shear strength to aluminum, psi||2000|
|Water Absorption (24 hr at RT), %||0.007|
Thermal Conductivity, W/mK
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